UMSB30M Overview
1 Output Anode（+） 2 Output Cathode（-） 3 Input Pin（~） 4 Input Pin（~） Case: Solderable per MIL-STD-750, Method 2026 Approx. 0.234g / 0.00825oz 1 2 3 UMSB Package Maximum Ratings and Ratings at 25 °C ambient temperature unless otherwise specified.
UMSB30M Key Features
- Glass Passivated Chip Junction
- Reverse Voltage
- 100 to 1000 V
- Forward Current
- Fast reverse recovery time
- Designed for Surface Mount Application
- Case: UMSB
- Terminals: Solderable per MIL-STD-750, Method 2026
- Approx. Weight: 0.234g / 0.00825oz