ES1GBF Overview
Key Features
- For surface mounted applications
- Low profile package
- Glass Passivated Chip Junction
- Superfast reverse recovery time
- Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA
- Terminals: Solderable per MIL-STD-750, Method 2026
- Approx. Weight: 57mg / 0.002oz ES1ABF THRU ES1JBF PINNING PIN DESCRIPTION 1 Cathode 2 Anode 12 Simplified outline SMBF and symbol
