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GLZ2.0 - 500mW SUFACE MOUNT ZENER DIODE

Key Features

  • Planar Die construction.
  • 500mW Power Dissipation.
  • Ideally Suited for Automated Assembly Processes.
  • Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above.

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Datasheet Details

Part number GLZ2.0
Manufacturer KD
File Size 1.48 MB
Description 500mW SUFACE MOUNT ZENER DIODE
Datasheet download datasheet GLZ2.0 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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GLZ2.0 ~ GLZ56 500mW SUFACE MOUNT ZENER DIODE FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above MECHANICAL DATA • Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 2026 • Polarity: See Diagram Below • Approx. Weight: 0.03 grams • Mounting Position: Any MINI-MELF / LL-34 0.063(1.6) 0.055(1.4) DIA. 0.020(0.5) 0.012(0.3) 0.146(3.7) 0.130(3.3) 0.020(0.5) 0.012(0.