GENERAL DESCRIPTION
FEATURES
VDSS(Min.)= 400V, ID= 2A Drain-Source ON Resistance : RDS(ON)=3.4 Qg(typ.) =4.4nC (max) @VGS =10V MAXIMUM RATING (Tc=25 ) CHARACTERISTIC SYMBOL RATING Drain-Source Voltage VDSS 400 Gate-Source Voltage VGSS 30 Drain Current @TC=25 @TC=100 2* ID 1.2* Pulsed (Note1) Single Pulsed Avalanche Energy (Note 2) Repetitive Avalanche Energy (Note 1) Peak Diode Recovery dv/dt (Note 3) IDP EAS EAR dv/dt 6* 52 0.2 4.5 Drain Power Dissipation TA=25 Derate above25 PD 2** 0.02 Maximum Junction Temperature Tj 150 Storage Temperature Range Tstg -55 150 Thermal Characteristics Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-toAmbient RthJC RthJA 10.0 62.5** * : Drain current limited by maximum junction temperature. ** : Surface Mounted on FR4 Board 2 Inch 2 Inch 1mm. UNIT V V A mJ mJ V/ns W W/ /W /W PIN CONNECTION KF3N40W N CHANNEL MOS FIELD EFFECT TRANSISTOR 2010. 6. 16 Revision No : 0 1/6 KF3N40W ELECTRICAL CHARACTERISTICS
(Tc=25 ) CHARACTERISTIC SYMBOL TES...