FEATURES
¡¤ ¡¤ ¡¤ ¡¤ ¡¤ ¡¤ ¡¤ EMI/RFI filtering ESD Protection to IEC 61000-4-2 Level 4 Low insertion loss Good attenuation of high frequency signals Low clamping voltage Low operating and leakage current Four elements in one package J GND PAD H 8 Pin 1 B F D 5 TOP VIEW BOTTOM VIEW K L SIDE VIEW DESCRIPTION
The UDFN package is a very effective PCB space occupation and a very thin package (0.4mm Pitch, 0.5mm height) 1,8 : Filter channel 1 2,7 : Filter channel 2 3,6 : Filter channel 3 4,5 : Filter channel 4 DIM A B C D E F G H J K L MILLIMETERS _ 0.10 1.70 + _ 0.10 1.35 + _ 0.10 1.20 + _ 0.05 0.20 + 0.40 _ 0.10 0.40 + _ 0.10 0.25 + 0.20 Min _ 0.05 0.50 + 0.127 0.02+0.03/-0.02 UDFN-8B MARKING Type Name CHARACTERISTIC DC Power Per Resistor Power Dissipation Junction Temperature Storage Temperature * Total Package Power Dissipation SYMBOL PR *PD Tj Tstg RATING 100 400 150 -55 150 UNIT mW 0 A MAXIMUM RATING (Ta=25¡É ) V1 Lot No. RECOMMENEDED FOOTPRINT (dimensions in mm) 0.40 0.30 EQUIVALENT...