THGBMJG6C1LBAIL Description
THGBMJG6C1LBAIL 8GB THGBMJG6C1LBAIL e-MMC Module INTRODUCTION THGBMJG6C1LBAIL is 8GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMJG6C1LBAIL has an industry standard MMC protocol for easy use.
THGBMJG6C1LBAIL Key Features
- Part Number