THGBMJG6C1LBAIL - 8GB density of e-MMC Module

Datasheet Summary

Features

THGBMJG6C1LBAIL Interface THGBMJG6C1LBAIL has the JEDEC / MMCA Version 5.1 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm(max. ) package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 11 NC NC NC NC NC NC 10 NC NC NC VSF VSF RFU VSS VCC RFU NC NC RFU 9 NC NC NC VSF VCC NC NC NC 8 NC NC NC RFU VSS NC NC NC 7 RFU NC NC VSS Top Vi.

THGBMJG6C1LBAIL 8GB density of e-MMC Module by KIOXIA - Datasheet Preview — Datasheet preview – THGBMJG6C1LBAIL

Datasheet Details

Part number	THGBMJG6C1LBAIL
Manufacturer	KIOXIA
File Size	641.92 KB
Description	8GB density of e-MMC Module
Datasheet	THGBMJG6C1LBAIL Datasheet
Additional preview pages of the THGBMJG6C1LBAIL datasheet.

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THGBMJG6C1LBAIL 8GB THGBMJG6C1LBAIL e-MMC Module INTRODUCTION THGBMJG6C1LBAIL is 8GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMJG6C1LBAIL has an industry standard MMC protocol for easy use. FEATURES THGBMJG6C1LBAIL Interface THGBMJG6C1LBAIL has the JEDEC / MMCA Version 5.1 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm(max.

Published: Nov 1, 2025 |