• Part: THGBMJG6C1LBAIL
  • Description: 8GB density of e-MMC Module
  • Manufacturer: KIOXIA
  • Size: 641.92 KB
Download THGBMJG6C1LBAIL Datasheet PDF
KIOXIA
THGBMJG6C1LBAIL
FEATURES THGBMJG6C1LBAIL Interface THGBMJG6C1LBAIL has the JEDEC / MMCA Version 5.1 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm(max.) package) NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC VSF VSF RFU VSS VCC RFU NC NC RFU NC NC NC NC NC NC NC NC NC NC NC NC RFU NC NC VSS Top View RFU NC NC RFU VSS DAT7 VCCQ CLK NC VSSQ DAT2 DAT6 NC RFU VCC VSS DS VSS...