C0805C100J1GAC Overview
CERAMIC CHIP CAPACITORS ELECTRODES L B TIN PLATE NICKEL PLATE CONDUCTIVE METALLIZATION DIMENSIONS—MILLIMETERS AND (INCHES) 0.20 (0.008)-0.40 (0.016) S MIN. SEPARATION 0.3 (.012) 0.7 (.028) 0.75 (.030) N/A N/A N/A N/A N/A N/A MOUNTING TECHNIQUE C 0805 C 103 K 5 R A C*
C0805C100J1GAC Key Features
- C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
- 10, 16, 25, 50, 100 and 200 Volts
- Standard End Metalization: Tin-plate over nickel barrier
- ±0.10pF J
- ±0.25pF K
- ±10% D
- ±0.5pF M
- ±20% F
- special order only G
- +80%, -20% END METALLIZATION C-Standard (Tin-plated nickel barrier) FAILURE RATE LEVEL A- Not Applicable