C1210C103K2RAC Overview
CERAMIC CHIP.
C1210C103K2RAC Key Features
- C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
- 10, 16, 25, 50, 100 and 200 Volts
- Standard End Metalization: Tin-plate over nickel barrier
- ±0.10pF J
- ±0.25pF K
- ±10% D
- ±0.5pF M
- ±20% F
- special order only G
- +80%, -20% END METALLIZATION C-Standard (Tin-plated nickel barrier) FAILURE RATE LEVEL A- Not Applicable