C1210C106K8PAC Datasheet | Kemet Corporation

CERAMIC CHIP CAPACITORS Features - C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics - 10, 16, 25, 50, 100 and 200 Volts - Standard End Metalization: Tin-plate over nickel barrier - Available Capacitance Tolerances: ±0.10 p F; ±0.25 p F; ±0.5 p F; ±1%; ±2%; ±5%; ±10%; ±20%; and +80%-20% KEMET ® - Tape and reel packaging per EIA481-1. (See page 61 for specific tape and reel information.) Bulk Cassette packaging (0402, 0603, 0805 only) per IEC60286-6 and EIAJ 7201. CAPACITOR OUTLINE DRAWINGS ELECTRODES TIN PLATE NICKEL PLATE CONDUCTIVE METALLIZATION DIMENSIONS- MILLIMETERS AND (INCHES) EIA SIZE CODE 0402- 0603- 0805- 1206- 1210- 1812 1825- 2220 2225 METRIC SIZE CODE (Ref only) 1005 1608 2012 3216 3225 4532 4564 5650 5664 L# LENGTH 1.0 (.04) ± .05(.002) 1.6 (.063) ± 0.15 (.006) 2.0 (.079) ± 0.2 (.008) 3.2 (.126) ± 0.2 (.008) 3.2 (.126) ± 0.2 (.008) 4.5 (.177) ± 0.3 (.012) 4.5 (.177) ± 0.3 (.012) 5.6 (.220) ± 0.4 (.016) 5.6 (.220) ± 0.4 (.016) W# WIDTH 0.5 (.02) ± .05 (.002) 0.8 (.032) ± 0.15 (.006) 1.25 (.049) ± 0.2 (.008) 1.6 (.063) ± 0.2 (.008) 2.5 (.098) ± 0.2 (.008) 3.2 (.126) ± 0.3 (.012) 6.4 (.252) ± 0.4 (.016) 5.0 (.197) ± 0.4 (.016) 6.3 (.248) ± 0.4 (.016) B BANDWIDTH 0.20 (0.008)-0.40 (0.016) S MIN. SEPARATION 0.3 (.012) 0.7 (.028) 0.75 (.030) N/A N/A N/A N/A N/A N/A MOUNTING TECHNIQUE Solder Reflow See pages 48-52 for thickness dimensions. 0.35 (.014) ±0.15 (.006) 0.5 (.02) ±.25 (.010) 0.5 (.02) ±.25 (.010) 0.5 (.02) ±.25 (.010) 0.6 (.024) ±.35 (.014) 0.6 (.024) ±.35 (.014) 0.6 (.024) ±.35 (.014) 0.6 (.024) ±.35 (.014) Solder Wave † or Solder Reflow Solder...