MJD32 Datasheet PDF

FEATURES

Lead Formed for Surface Mount

APPLICATIONS

in Plastic Sleeves Pb-Free Packages are Available +09.70 .2 -0.2 TO-252 6.50+0.15 -0.15 5.30+0.2 -0.2 2.30+0.1 -0.1 0.50+0.8 -0.7 +01.50 .15 -0.15 0.80+0.1 -0.1 0.127 max +0.50 0.15 -0.15 +1.50 0.28 -0.1 2.3 4.60+0.15 -0.15 0.60+0.1 -0.1

ABSOLUTE MAXIMUM RATINGS

Ta = 25 Parameter Collector-emitter voltage MJD31,MJD32 MJD31C,MJD32C Collector-base voltage MJD31,MJD32 MJD31C,MJD32C Emitter-base voltage Collector current Collector current (pulse) Base current Total Device Dissipation FR-5 Board @TA = 25 Derate above 25 Total Device Dissipation Alumina Substrate @TA = 25 Derate above 25 Junction temperature Storage temperature Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient Lead Temperature for Soldering Purposes Symbol VCEO VCB VEB IC ICP IB PD PD Tj Tstg RèJC RèJA TL Rating 40 100 40 100