Download RS1DFH Datasheet PDF
RS1DFH page 2
Page 2
RS1DFH page 3
Page 3

RS1DFH Description

thickness of copper ≥ 35 mm. Note.2 Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥ 40 mm.

RS1DFH Key Features

  • Low leakage current
  • Excellent stability
  • Guaranteed avalanche energy absorption capability
  • Glass passivated
  • High maximum operating temperature