Datasheet4U Logo Datasheet4U.com

AM27SURCK08 - SUBMINIATURE SOLID STATE LAMP

Description

The Hyper Red source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode.

OLONG LIFE-SOLID STATE RELIABILITY.

OLOW PACKAGE PROFILE.

📥 Download Datasheet

Datasheet preview – AM27SURCK08

Datasheet Details

Part number AM27SURCK08
Manufacturer Kingbright Corporation
File Size 150.56 KB
Description SUBMINIATURE SOLID STATE LAMP
Datasheet download datasheet AM27SURCK08 Datasheet
Additional preview pages of the AM27SURCK08 datasheet.

📁 Similar Datasheet

  • AM27S02 - (AM27S02 / AM27S03) 64-Bit Inverting-Output Bipolar RAM (AMD)
  • AM27S03 - (AM27S02 / AM27S03) 64-Bit Inverting-Output Bipolar RAM (AMD)
  • AM27S07 - 64-Bit NonInverting-Output Bipolar RAM (AMD)
  • AM27S13 - 2K-Bit Bipolar PROM (AMD)
  • AM27S13A - 2K-Bit Bipolar PROM (AMD)
  • AM27S181 - 8/192-BIT (1024 X 8) BIPOLAR PROM (Advanced Linear Devices)
  • AM27S181A - 8/192-BIT (1024 X 8) BIPOLAR PROM (Advanced Linear Devices)
  • AM27S19 - 256-Bit Dipolar PROM (AMD)
  • AM27S191 - 16384-BIT (2048 x 8) BIPOLAR PROM (Advanced Micro Devices)
  • AM27S191A - 16384-BIT (2048 x 8) BIPOLAR PROM (Advanced Micro Devices)
Other Datasheets by Kingbright Corporation

Full PDF Text Transcription

Click to expand full text
SUBMINIATURE SOLID STATE LAMP AM27SURCK08 HYPER RED Features OSUBMINIATURE PACKAGE. OWIDE VIEWING ANGLE. OYOKE LEAD. Description The Hyper Red source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. OLONG LIFE-SOLID STATE RELIABILITY. OLOW PACKAGE PROFILE. ORoHS COMPLIANT. OPACKAGE : 1000PCS / REEL. Package Dimensions www.DataSheet4U.com Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the lead emerge from the package. 4. Specifications are subject to change without notice. SPEC NO: DSAD1313 APPROVED: J. Lu REV NO: V.2 CHECKED: Allen Liu DATE: MAR/10/2005 DRAWN: S.H.CHEN PAGE: 1 OF 4 ERP:1202000397 Selection Guide Part No.
Published: |