KC2016B-C1 Kyocera Kinseki Datasheet

KC2016B-C1 Key Features

•  Ultra Miniture ceramic package 2.0 (L) ×1.6 (W) ×0.55 (H) mm (Typ.) - Highly reliable with seam welding - CMOS outpu
• 90% VCC
• 70% VCC
• 15 VCC 30% VCC
• 100 5 10 Units MHz ppm °C °C V V mA µA % nS V V pF V V V nS mS mS