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MK71050-03 - Low Energy wireless module

General Description

.） 2 NC --- --- --- No connection（※Refer to PIN descriptions.） 3-4 ANT_GND --- --- --- Antenna GND（※Refer to PIN descriptions.） 5 NC --- --- --- No connection（※Refer to PIN descriptions.） 6 OUT_ANT INOUT ANA --- Output from Antenna (to be connected to OUT_MOD by user's PCB) 7 OUT_MOD IN

Key Features

  • >.
  • Bluetooth® SIG Core Spec v4.0 compliant.
  • Radio certification MIC JAPAN(certification no:006-000238） FCC（FCC ID:2ACIJ71050-3） CE（R&TTE）.
  • Bluetooth® Qualification（End Product、QDID:66491）.
  • Integrating ML7105C-001 Bluetooth® LE single mode LSI.
  • Integrating 26MHz xtal oscillator.
  • Integrating 128kbit EEPROM.
  • Single power supply 1.8V to 3.6V.
  • Operating Temperature -20 deg. C to 70 deg. C.
  • Current Consumptions Deep.

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Datasheet Details

Part number MK71050-03
Manufacturer LAPIS Semiconductor
File Size 596.01 KB
Description Low Energy wireless module
Datasheet download datasheet MK71050-03 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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MK71050-03 Bluetooth® Low Energy wireless module FEDK71050-03-01 Issue Date：Apr,10,2015 ■Overview MK71050-03 is a Bluetooth® Low Energy (here in after LE) wireless module which is integrating ML7105C-001 Bluetooth LE SoC, E2PROM, 26MHz crystal oscillator, 2.4GHz PCB pattern antenna and passive components. It has Bluetooth® LE compliant 2.4GHz band radio communication capability. MK71050-03 is suitable for applications such as Healthcare device, Remote Controller or PC peripherals. ■Features • Bluetooth® SIG Core Spec v4.