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MK71251-01 Datasheet Bluetooth Smart Wireless Module

Manufacturer: LAPIS

Overview: MK71251-01/MK71251-02  Bluetooth Smart wireless module FEDK71251-01 Issue Date:Apr,27,2016 ■ Overview MK71251-01/-02 is a Bluetooth® Smart wireless module which is integrating Bluetooth® SIG Core Spec v4.1 pliant LSI (ML7125-001/-002), E2PROM,26MHz/32.768kHz crystal oscillator, 2.4GHz PCB pattern antenna and passive ponents. MK71251-01/-02 is suitable for applications such as Healthcare, fitness device, Remote Controller or PC peripherals.

Datasheet Details

Part number MK71251-01
Manufacturer LAPIS
File Size 874.87 KB
Description Bluetooth Smart wireless module
Datasheet MK71251-01-LAPIS.pdf

Key Features

  • >.
  • Bluetooth® SIG Core Spec v4.1 compliant.
  • Radio certification MIC JAPAN(certification no: 006-000373[MK71251-01] / 006-000384[MK71251-02]) FCC (FCC ID:2ACIJ71251) IC(IC: 20971-K71251) CE/R&TTE.
  • Bluetooth® Qualification(End Product, QDID:77987).
  • Integrating Bluetooth® SIG Core Spec v4.1 compliant LSI (ML7125-001/ML7125-002).
  • Integrating 26MHz/32.768kHz crystal oscillator.
  • Integrating 128kbit EEPROM.
  • Integrating bypass capacitor and external component of s.

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