BYG21M Datasheet | LGE

Features Glass passivated junction chip For surface mounted application Low profile package Built-in strain relief Ideal for automated placement Easy pick and place Ultrafast recovery time for high efficiency Low forward voltage, low power loss High temperature soldering guaranteed: 260o C/10 seconds on terminals Plastic material used carries Underwriters Laboratory Classification 94V0 Mechanical Data SMA/DO-214AC 0.063(1.60) 0.051(1.30) 0.096(2.45) 0.078(2.00) 0.059(1.50) 0.035(0.90) 0.181(4.60) 0.161(4.10) 0.108(2.75) 0.096(2.45) 0.209(5.30) 0.193(4.90) 0.012(0.30) 0.006(0.15) 0.008(0.20) 0.002(0.05) Cases: Molded plastic Polarity: Indicated by cathode band Weight: 0.064 gram Dimensions in inches and(millimeters) Maximum Ratings and Electrical Characteristics Rating at 25 o C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Type Number Symbol BYG21K Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current @ TL=110 o C Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) VRRM VRMS VDC I(AV) IFSM 800 560 800 1000 700 1000 Maximum Instantaneous Forward Voltage @ 1.0A @ 1.5A Maximum DC Reverse Current @ TJ=25 o C at Rated DC Blocking Voltage @ TJ=125 o...