ES2C Datasheet | LGE

Features Glass passivated junction chip For surface mounted application Low profile package Built-in strain relief Ideal for automated placement Easy pick and place Superfast recovery time for high efficiency Glass passivated chip junction High temperature soldering: 260OC/10 seconds at terminals Plastic material used carries Underwriters Laboratory Classification 94V-0 Mechanical Data Cases: Molded plastic Terminals: Pure tin plated, lead free. Polarity: Indicated by cathode band Weight: 0.093 gram Dimensions in inches and (millimeters) Maximum Ratings and Electrical Characteristics Rating at 25 OC ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Type Number Symbol ES ES ES ES ES ES ES ES 2A 2B 2C 2D 2F 2G 2H 2J Maximum Recurrent Peak Reverse Voltage VRRM 50 100 150 200 300 400 500 600 Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current See Fig. 1 VRMS VDC I(AV) 35 70 105 140 210 280 350 420 50 100 150 200 300 400 500 600 Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) IFSM Maximum Instantaneous Forward Voltage @ 2.0A 1.3 1.7 Maximum DC Reverse Current @TA =25o C at Rated DC Blocking Voltage @ TA=100 o C Maximum Reverse Recovery Time ( Note 1 ) IR Trr 10 350 Typical Junction Capacitance ( Note 2 ) Cj Maximum Thermal Resistance (Note 3) Operating Temperature Range RθJA RθJL 75 20 -55 to +150 Storage Temperature...