GL1A Datasheet | LGE

Features — Plastic package has underwriters laboratory flammability classifications —1 For surface mounted applications — Low profile package — Built-in strain relief,ideal for automated placement — Glass passivated chip junction — High temperature soldering: — 250o C/10 seconds at terminals Mechanical Data — Case:JEDEC DO-213AA,molded plastic over 1 passivated chip — Polarity: Color band denotes cathode end — Weight: 0.0014 ounces, 0.036 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25o C ambient temperature unless otherwise specified D1 1.6± 0.1 REVERSE VOLTAGE: 50 - 1000 V CURRENT: 1.0 A - 213AA SOLDERABLE ENDS D2=D1 0 0.20 D2 0.5± 0.1 3.5± 0.2 0.5± 0.1 Dimensions in millimeters GL1A GL1B GL1D GL1G GL1J GL1K GL1M UNITS Maximumrecurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximumaverage forw ord rectified current V @TL=75 Peak forw ard surge current V 8.3ms single half-sine-w ave superimposed V on rated load (JEDEC Method) VRRM VRWS VDC IF(AV) IFSM 50 35 50 100 200 400 600 800 70 140 280 420 560 100 200 400 600 800 Maximuminstantaneous forw ard voltage at 1.0 A VF Maximum DC reverse current @TA=25o C at rated DC blockjing voltage @TA=125o C 5.0 50.0 Typical junction capacitance(NOTE2)...