Ledtech Electronics LC5641-11
The lead bending point must be more than 1.6mm away from the edge or the resin part. When necessary, no stress should be applied to the resin part and lead to consider dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board etc.| Part No. | LC5641-11 |
|---|---|
| Datasheet | LC5641-11 Download |
| Manufacturer |  Ledtech Electronics |
| Description | 0.56 Single Digit Display |
| Buy | Stock & Price |
DESCRIPTION
LED Chip Part No. Material GaAsP/GaP GaAsP/GaP 0.56" SINGLE DIGIT DISPLAY Face Color Surface Grey Grey Segments White White Emitting Color Orange Orange LA5641-11 EWRN LC5641-11 EWRNABSOLUTE MAXIMUM RATINGS
at Ta=25 Parameter Power Dissipation Per Segment Pulse Current(1/10Duty Cycle,0.1ms Pulse Width.) Per Chip Forward Current Per Chip Reverse (Leakage)Current Per Chip Reverse Voltage Per Chip Operating Temperature Range Storage Temperature Range Soldering Temperature. Symbol PD IFP IF Ir VR Topr. Tstg. Tsol. Rating 78 100 30 100 5 -25 to +85 -40 to +100 Dip Soldering: 260 Hand Soldering: 350 Unit mW mA mA uA V for 5 sec. for 3 sec. VER.: 01 Date: 2007/01/18 Page: 2/5 LA(C)5641-11 Electrical and Optical Characteristics: Parameter Luminous Intensity Per Segment Forward Voltage 0.56" SINGLE DIGIT DISPLAY Symbol IV Vf λp λd Ir Condition If=10mA/seg. If=20mA/seg. If=20mA/seg. If=20mA/seg. Vr=5V If=20mA/seg. ----------- Min. 1.15 Typ. 3.3 2.1 635 626 Max. Unit mcd 2.6 V nm nm...
