Ledtech LC4141-82
The lead bending point must be more than 1.6mm away from the edge or the resin part. When necessary, no stress should be applied to the resin part and lead to consider dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board etc.| Part No. | LC4141-82 |
|---|---|
| Datasheet | LC4141-82 Download |
| Manufacturer |  Ledtech |
| Description | SINGLE DIGIT DISPLAY |
| Buy | Stock & Price |
DESCRIPTION
Part No. LA4141-82 EWEW LED Chip Face Color Material Emitting Color Surface Segments GaAsP/GaP Orange Grey White LC4141-82 EWEW GaAsP/GaP Orange Grey WhiteABSOLUTE MAXIMUM RATINGS
at Ta=25 Parameter Symbol Rating Unit Power Dissipation Per Segment Pulse Current(1/10Duty Cycle,0.1ms Pulse Width.) Per Chip Forward Current Per Chip DP PD SEG IFP IF 156 624 100 30 mW mA mA Reverse (Leakage)Current Per Chip Ir 100 uA Reverse Voltage Per Chip VR 5 V Operating Temperature Range Topr. -25 to +85 Storage Temperature Range Soldering Temperature. Tstg. Tsol. -40 to +100 Dip Soldering: 260 for 5 sec. Hand Soldering: 350 for 3 sec. VER.: 01 Date: 2007/01/26 Page: 2/5 LA(C)4141-82 Electrical and Optical Characteristics: 4.0" SINGLE DIGIT DISPLAY Parameter Symbol Condition Min. Typ. Max. Unit Luminous Intensity Per Segment IV If=10mA/seg. Forward Voltage DP Vf SEG If=20mA/seg. If=20mA/seg. Peak Wavelength λp If=20mA/seg. 3.7 9.8 mcd 4.2 5.2 8.4 10.4 V 635 nm Dominant Wavelength Reverse Current Per Chip (Leakage Current Per Chip) Spectrum Line Halfwidth λd If=20mA/seg.
