Ledtech LM2444-14
The lead bending point must be more than 1.6mm away from the edge or the resin part. When necessary, no stress should be applied to the resin part and lead to consider dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board etc.| Part No. | LM2444-14 |
|---|---|
| Datasheet | LM2444-14 Download |
| Manufacturer |  Ledtech |
| Description | FOUR DIGIT DISPLAY |
| Buy | Stock & Price |
DESCRIPTION
Part No. LN2444-14 EWRN LM2444-14 EWRN LN(M)2444-14 0.24" FOUR DIGIT DISPLAY LED Chip Material Emitting Color Face Color Surface Segments GaAsP/GaP Orange Grey White GaAsP/GaP Orange Grey WhiteABSOLUTE MAXIMUM RATINGS
at Ta=25 Parameter Symbol Rating Unit Power Dissipation Per Segment Pulse Current(1/10Duty Cycle,0.1ms Pulse Width.) Per Chip Forward Current Per Chip Reverse (Leakage)Current Per Chip Reverse Voltage Per Chip Operating Temperature Range Storage Temperature Range Soldering Temperature. PD IFP IF Ir VR Topr. Tstg. Tsol. 78 mW 100 mA 30 mA 100 uA 5V -25 to +85 -40 to +100 Dip Soldering: 260 for 5 sec. Hand Soldering: 350 for 3 sec. VER.: 01 Date: 2007/01/28 Page: 2/5 LN(M)2444-14 Electrical and Optical Characteristics: 0.24" FOUR DIGIT DISPLAY Parameter Luminous Intensity Per Segment Forward Voltage Peak Wavelength Dominant Wavelength Reverse Current Per Chip (Leakage Current Per Chip) Spectrum Line Halfwidth Response Time Symbol Condition Min. Typ. Max. Unit IV If=10mA/seg.
