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LM3623-11 Datasheet PDF

Ledtech LM3623-11

The lead bending point must be more than 1.6mm away from the edge or the resin part. When necessary, no stress should be applied to the resin part and lead to consider dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board etc.
Part No. LM3623-11
Datasheet LM3623-11 Download
Manufacturer
Ledtech
Description THREE DIGIT DISPLAY
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LM3623-11 datasheet page 1 preview

DESCRIPTION

Part No. LN3623-11 EWRN LM3623-11 EWRN LN(M)3623-11 0.36" THREE DIGIT DISPLAY LED Chip Material Emitting Color Face Color Surface Segments GaP/GaP Green Grey White GaP/GaP Green Grey White

ABSOLUTE MAXIMUM RATINGS

at Ta=25 Ċ Parameter Symbol Rating Unit Power Dissipation Per Segment Pulse Current(1/10Duty Cycle,0.1ms Pulse Width.) Per Chip Forward Current Per Chip Reverse (Leakage)Current Per Chip Reverse Voltage Per Chip Operating Temperature Range Storage Temperature Range Soldering Temperature. PD IFP IF Ir VR Topr. Tstg. Tsol. 78 mW 100 mA 30 mA 100 uA 5 V -25 to +85 Ċ -40 to +100 Ċ Dip Soldering: 260Ċ for 5 sec. Hand Soldering: 350Ċ for 3 sec. VER.: 01 Date: 2007/01/17 Page: 2/5 LN(M)3623-11 Electrical and Optical Characteristics: 0.36" THREE DIGIT DISPLAY Parameter Luminous Intensity Per Segment Forward Voltage Peak Wavelength Dominant Wavelength Reverse Current Per Chip (Leakage Current Per Chip) Spectrum Line Halfwidth Response Time Symbol Condition Min. Typ. Max. Unit IV If=10mA/seg.
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