S50VB100 Datasheet | Leshan Reeshine

乐山市睿芯电子有限责任公司 Leshan Reeshine Electronic Co.,LTD S50VB100 单相桥式整流器规格书 外形图 Outside View 线路图 Circuit 特点 Features 合并塑封的散热片，热阻抗低，散热量大 Integrally molded heatsink provide very low thermal resistance for maximum heat dissipation 浪涌过载额定值达 500 安培 Surge overload ratings to 500 Amperes 玻钝芯片结 Glass passivated chip junctions 高温焊接保证：260℃+5℃/10 秒，拉力 2.3Kg.F High temperature soldering guaranteed: 260℃+5℃/10 seconds，(2.3kg.F)tension 机械数据 MECHANICAL DATA 外壳：塑料与散热片一起封在桥壳内 Case: Molded plastic with heatsink integrally mounted in the bridge encapsulation 端子：镀镍 0.25＂（6.35mm）接线端子 Terminals:Nickelplaed 0.25＂（6.35mm）Faston lugs 安装：用 M5 螺丝固定在散热片上，桥和安装表面之间填充硅热混合物以达到最佳 的散热效果 Mounting Position:Fixing...