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Leshan Reeshine Electronic Co.,LTD
S50VB100
S50VB100
Outside View Circuit
FEATURES
,, Integrally molded heatsink provide very low thermal resistance for maximum heat dissipation
500 Surge overload ratings to 500 Amperes
Glass passivated chip junctions
:260℃+5℃/10 , 2.3Kg.F High temperature soldering guaranteed: 260℃+5℃/10 seconds,(2.3kg.F)tension
MECHANICAL DATA
: Case: Molded plastic with heatsink integrally mounted in the bridge encapsulation
: 0.25"(6.35mm) Terminals:Nickelplaed 0.25"(6.