20KP96A Datasheet | Liown

Description The 20KP series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Bi-directional Additional Information Maximum Ratings and Thermal Characteristics (TA=25℃ unless otherwise noted) Parameter Symbol Value Unit Peak Pulse Power Dissipation by 10/1000μs Waveform(Fig.1) (Note 1)-Single Die Parts PPPM Power Dissipation on Infinite Heat Sink at TL=75℃ Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 2) IFSM Operating Temperature Range TJ -55 to 150 ℃ Storage Temperature Range Typical Thermal Resistance Junction to Lead Typical Thermal Resistance Junction to Ambient TSTG -55 to 150 ℃ RƟJL 8 ℃/W RƟJA 40 ℃/W Notes: 1. Non-repetitive current pulse , per Fig.3 and derated above TJ (initial) =25℃ per Fig.2. 2. Measured on 8.3ms single half sine wave or equivalent square wave, duty cycle=4 per minute maximum. Features - 20000W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01% - Glass passivated chip junction in P600 package - Fast response time:typically less than 1.0ps from 0 Volts to VB min - Excellent clamping capability - Typical failure mode is a short circuit - Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c - ESD protection of data lines in accordance with IEC 61000-4-2, 30k V(Air), 30k V (Contact) - EFT protection of data lines in accordance with IEC 61000-4-4 - Low incremental surge resistance - Typical IR less than 2μA when VR >40V - High temperature to reflow soldering guaranteed: 260℃/ 20~40sec./ 0.375”,(9.5mm) lead length, 5 lbs., (2.3kg) tension - VB @ TJ= VB@25℃x (1+αT x (TJ - 25))(αT:Temperature Coefficient, typical value is 0.1%) - Matte tin lead- free...