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P6SMB200A Datasheet Tvs Diodes

Manufacturer: Littelfuse

Overview: P6SMB Series TVS Diodes Surface Mount – 600W > P6SMB series RoHS Pb e3 Uni-directional Bi-directional Agency Approvals Agency Agency File Number E230531 Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Symbol Value Unit Peak Pulse Power Dissipation(Fig.2) by 10/1000us Test Waveform(Fig.4) (Note 1),(Note 2) -Single Die Parts Peak Pulse Power Dissipation(Fig.2) by 10/1000us Test Waveform(Fig.4) (Note.1, Note.2)-Stacked Die Parts (Note.5) PPPM PPPM 600 W 800 W Power Dissipation on Infinite Heat Sink at TL=50OC PD Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3) IFSM Maximum Instantaneous Forward Voltage at 50A for Unidirectional Only (Note 4) VF 5.0 W 100 A 3.5/5.0 V Operating Temperature Range Storage Temperature Range Typical Thermal Resistance Junction to Lead Typical Thermal Resistance Junction to Ambient TJ -65 to 150 °C TSTG -65 to 175 °C RƟJL 20 °C/W RƟJA 100 °C/W Notes: 1. Non-repetitive current pulse , per Fig. 4 and derated above TJ (initial) =25OC per Fig. 3. 2. Mounted on copper pad area of 0.2x0.2” (5.0 x 5.0mm) to each terminal. 3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty cycle=4 per minute maximum. 4. VF < 3.5V for single die parts and VF< 5.0V for stacked-die parts. 5. For stacked die component details, please refer to part numbers labeled by * in Electrical Characteristics.

This datasheet includes multiple variants, all published together in a single manufacturer document.

General Description

The P6SMB series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.

Key Features

  • 600W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%.
  • Excellent clamping capability.
  • Low incremental surge resistance.
  • Typical IR less than 1μA when VBR min>12V.
  • Optimized surface mount footprint for minimal PCB space impact.
  • Low profile package.
  • Typical failure mode due to exceeding maximum ratings is a short circuit condition.
  • Whisker test conducted based on Table 4a and 4c of JE.

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