Littelfuse SMD1210
RESETTABLE FUSES
FEATURES
This product line is designed for surface-mount applications with a range in hold currents from 50 mA to 1.5 A and voltages from 6 V to 30 V. These smaller devices (1210-mil footprint) are ideally suited for palm PC, PDAs and applications where space is constrained and circuit protection is required. Suitable for reflow soldering Solder pad Layout (mm) 2.0 2.5 Specifications Packaging A Blistertape and reel Ø 178 mm Materials Terminals: Solder-plated copper TS: Solder Material: 63/37 SnPb TF: Lead free plating on request Max. Device Surface Temperature in Tripped State 125 °C Operating / Storage Temperature -40 ºC to +85 ºC (consider de-rating) Humidity Ageing +85 °C, 85 % R.H., 1000 hours, ± 5 % typical resistance change Vibration MIL-STD-883C, Method 2007.1, Condition A, no change Thermal Shock MIL-STD-202F, Method 107G +85 °C to -40 °C 20 times, -30 % typical resistance change Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002, Category 3 Reflow only Solvent Resista...