SP3012-04UTG Overview
Key Specifications
Package: DFN
Mount Type: Surface Mount
Pins: 10
Height: 550 µm
Description
The SP3012 Series integrates 6 channels of ultra low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust devices can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (±8kV contact discharge) without performance degradation.
Key Features
- EFT, IEC 61000-4-4, 40A (tP=5/50ns)
- Low capacitance of 0.5pF (TYP) per I/O
- Low leakage current of 1.5μA (MAX) at 5V
- S mall form factor μDFN (JEDEC MO-229) package provides flow through routing to simplify PCB layout
- AEC-Q101 Qaulified
