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LM102202-H-C-301 - PIN Diode Limiter

Download the LM102202-H-C-301 datasheet PDF. This datasheet also covers the LM102202-H-C-301-MA variant, as both devices belong to the same pin diode limiter family and are provided as variant models within a single manufacturer datasheet.

General Description

The LM102202-H-C-301 surface mount silicon PIN diode limiters is manufactured using proven hybrid manufacturing process incorporating PIN diodes and passive devices integrated within a ceramic substrate.

Key Features

  • Surface Mount Limiter in 8 mm x 5 mm x 2.5 mm Package.
  • Incorporates PIN Limiter & Schottky Diodes.
  • DC Blocks & DC Return.
  • Higher Average Power Handling than Plastic: 50 W CW Power.
  • Lower Insertion Loss: 0.8 dB.
  • Lower Flat Leakage Power: 17 dB.
  • RoHS.
  • Compliant.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (LM102202-H-C-301-MA-COM.pdf) that lists specifications for multiple related part numbers.

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Other Datasheets by MACOM Technology Solutions

Part Number Description
LM102202-Q-A-301 PIN Diode Limiter
LM102202-Q-B-301 PIN Diode Limiter
LM102202-Q-C-301 PIN Diode Limiter

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
LM102202-H-C-301 PIN Diode Limiter Features  Surface Mount Limiter in 8 mm x 5 mm x 2.5 mm Package  Incorporates PIN Limiter & Schottky Diodes  DC Blocks & DC Return  Higher Average Power Handling than Plastic: 50 W CW Power  Lower Insertion Loss: 0.8 dB  Lower Flat Leakage Power: 17 dB  RoHS* Compliant Description The LM102202-H-C-301 surface mount silicon PIN diode limiters is manufactured using proven hybrid manufacturing process incorporating PIN diodes and passive devices integrated within a ceramic substrate. This low profile, compact, surface mount component, (8 mm L x 5 mm W x 2.5 mm H) offers superior low and high signal performance to comparable MMIC devices in QFN packages.