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LM202802-Q-C-301 - PIN Diode Limiter

Download the LM202802-Q-C-301 datasheet PDF. This datasheet also covers the LM202802-Q-B-301-MA variant, as both devices belong to the same pin diode limiter family and are provided as variant models within a single manufacturer datasheet.

General Description

The LM202802‐Q‐x‐301 Surface Mount Silicon PIN Diode Limiters are manufactured using a proven hybrid manufacturing process incorporating PIN diodes and passive devices integrated within a ceramic substrate.

Key Features

  • Surface Mount SP2T Switch in Compact Outline: 8 L x 5 W x 2.5 H mm Package.
  • Incorporates PIN Limiter & Schottky Diodes.
  • DC Blocks & DC Return.
  • Higher Average Power Handling than Plastic Packaged MMIC Switches: 100 W CW.
  • Low Insertion Loss: 1.1 dB.
  • Low Flat Leakage Power: 21 dBm.
  • RoHS.
  • Compliant Schematic Rev. V1.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (LM202802-Q-B-301-MA-COM.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

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Other Datasheets by MACOM Technology Solutions

Part Number Description
LM202802-Q-B-301 PIN Diode Limiter
LM202802-L-C-300 PIN Diode Limiter
LM202802-M-C-300 PIN Diode Limiter
LM200802-M-A-300 PIN Diode Limiter

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
LM202802‐Q‐x‐301 PIN Diode Limiter 2 - 8 GHz Features  Surface Mount SP2T Switch in Compact Outline: 8 L x 5 W x 2.5 H mm Package  Incorporates PIN Limiter & Schottky Diodes  DC Blocks & DC Return  Higher Average Power Handling than Plastic Packaged MMIC Switches: 100 W CW  Low Insertion Loss: 1.1 dB  Low Flat Leakage Power: 21 dBm  RoHS* Compliant Schematic Rev. V1 Description The LM202802‐Q‐x‐301 Surface Mount Silicon PIN Diode Limiters are manufactured using a proven hybrid manufacturing process incorporating PIN diodes and passive devices integrated within a ceramic substrate. This low profile, compact, surface mount component, offers superior low and high signal performance to comparable MMIC devices in QFN packages.