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MAAM-010333 - Optical Node RF Amplifier

Download the MAAM-010333 datasheet PDF. This datasheet also covers the MAAM-010333-MA variant, as both devices belong to the same optical node rf amplifier family and are provided as variant models within a single manufacturer datasheet.

General Description

The MAAM-010333 provides high gain, low noise and low distortion amplification for optical node applications.

The MAAM-010333 is fabricated using M/A-COM Technology Solutions’ low noise GaAs pHEMT technology in a lead-free 4 mm 24-lead package.

Key Features

  •  -8 dBm to +2 dBm Optical Input Range.
  •  Low Equivalent Input Noise (EIN): 3.2 pA/rtHz.
  •  Single +5 V Bias.
  •  29 dB Gain at 55 MHz; 34 dB Gain at 1000 MHz.
  •  27 dB Gain Control Range.
  •  +24 dBmV/ch Output at 550 MHz.
  •  Lead-Free 4 mm PQFN-24LD Plastic Package.
  •  Halogen-Free “Green” Mold Compound.
  •  RoHS.
  • Compliant and 260°C Reflow Compatible.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MAAM-010333-MA-COM.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
MAAM-010333 Optical Node RF Amplifier 50 - 1000 MHz Rev. V3 Features  -8 dBm to +2 dBm Optical Input Range  Low Equivalent Input Noise (EIN): 3.2 pA/rtHz  Single +5 V Bias  29 dB Gain at 55 MHz; 34 dB Gain at 1000 MHz  27 dB Gain Control Range  +24 dBmV/ch Output at 550 MHz  Lead-Free 4 mm PQFN-24LD Plastic Package  Halogen-Free “Green” Mold Compound  RoHS* Compliant and 260°C Reflow Compatible Description The MAAM-010333 provides high gain, low noise and low distortion amplification for optical node applications. The MAAM-010333 is fabricated using M/A-COM Technology Solutions’ low noise GaAs pHEMT technology in a lead-free 4 mm 24-lead package. The amplifier requires a minimal number of off-chip components resulting in a highly integrated low cost solution.