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MASW-009276-000DIE - Bumped GaAs SP3T Switch

Download the MASW-009276-000DIE datasheet PDF (MASW-009276-000DIE-MA included). The manufacturer datasheet provides complete specifications, pinout details, electrical characteristics, and typical applications for bumped gaas sp3t switch.

Description

The MASW-009276-000DIE is a bumped GaAs pHEMT MMIC SP3T switch.

Typical applications are WLAN (802.11 b/g) and Bluetooth applications.

The MASW-009276-000DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz.

Features

  • 802.11b/g and Bluetooth.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MASW-009276-000DIE-MA-COM.pdf) that lists specifications for multiple related part numbers.

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Full PDF Text Transcription

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MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Rev. V2 Features • 802.11b/g and Bluetooth Applications • Low Insertion Loss: 0.5 dB 2.4 GHz to 2.5 GHz band • High Isolation: 32 dB Typical on RX • Low Harmonics: <-70 dBc @ 20 dBm • Flip-chip configuration • RoHS* Compliant Description The MASW-009276-000DIE is a bumped GaAs pHEMT MMIC SP3T switch. Typical applications are WLAN (802.11 b/g) and Bluetooth applications. Die Bump Pad Layout (bump side up) The MASW-009276-000DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz. This device is fabricated using a 0.5 micron gate length GaAs pHEMT process. The process features full passivation for performance and reliability. This die features SnAg (2.
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