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MASW-009276-000DIE

Manufacturer: MACOM Technology Solutions

MASW-009276-000DIE datasheet by MACOM Technology Solutions.

This datasheet includes multiple variants, all published together in a single manufacturer document.

MASW-009276-000DIE datasheet preview

MASW-009276-000DIE Datasheet Details

Part number MASW-009276-000DIE
Datasheet MASW-009276-000DIE MASW-009276-000DIE-MA Datasheet (PDF)
File Size 266.53 KB
Manufacturer MACOM Technology Solutions
Description Bumped GaAs SP3T Switch
MASW-009276-000DIE page 2 MASW-009276-000DIE page 3

MASW-009276-000DIE Overview

The MASW-009276-000DIE is a bumped GaAs pHEMT MMIC SP3T switch. Typical applications are WLAN (802.11 b/g) and Bluetooth applications. Die Bump Pad Layout (bump side up) The MASW-009276-000DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz.

MASW-009276-000DIE Key Features

  • 802.11b/g and Bluetooth
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MASW-009276-000DIE Distributor

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