MMP7078-128-1 Datasheet | MACOM Technology Solutions

Features - Non-Magnetic Ceramic Surface Mount Package - Low Series Resistance - Low Junction Capacitance - Low Thermal Resistance - Ro HS- pliant Description The MMP70xx-128-1 and MMP70xx-128-4 MELF PIN Diode Series are manufactured using a proprietary diode process which optimizes the anode and cathode bonding area of the diode to the adjacent heat spreading metal posts within the ceramic package. This unique geometry provides lower electrical and thermal resistance within the surface mount package to provide higher average power performance to parable surface mount diode packages. With lower thermal resistance (<20ºC/W), RF C.W. incident power levels of 50 d Bm and RF peak incident power levels of 60 d Bm are very achievable in higher power UHF cold switching applications. The low series resistance (<1 Ω), coupled with the longer minority carrier lifetime, (>8 µs), provides better IIP3 distortion values >70 d Bm, for SP2T TX &...