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MA4FCP300 - Flip Chip PIN Diode

General Description

The MA4FCP300 is a silicon flip chip PIN diode which is fabricated using MACOMs’ patented HMIC process.

The epitaxial silicon and processes used are designed to produce repeatable electrical characteristics and extremely low parasitics.

Key Features

  • Low Series Resistance: 2.6 Ω.
  • Low Capacitance: 40 fF.
  • Fast Switching Speed: 40 ns.
  • Silicon Nitride Passivation.
  • Polyimide Scratch Protection.
  • Designed for Automated Pick and Place Insertion.
  • Rugged Design.
  • RoHS Compliant.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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MA4FCP300 Flip Chip PIN Diode Features  Low Series Resistance: 2.6 Ω  Low Capacitance: 40 fF  Fast Switching Speed: 40 ns  Silicon Nitride Passivation  Polyimide Scratch Protection  Designed for Automated Pick and Place Insertion  Rugged Design  RoHS Compliant Description The MA4FCP300 is a silicon flip chip PIN diode which is fabricated using MACOMs’ patented HMIC process. The epitaxial silicon and processes used are designed to produce repeatable electrical characteristics and extremely low parasitics. The diode is fully passivated with silicon nitride and also has an additional layer of polyimide for scratch protection. These protective coatings prevent damage to the junction area during manual or automated handling making it suitable for pick and place insertion.