5.0SMLJ11A Datasheet | Micro Commercial Components

Features - Low Inductance - Built in Strain Relief - For Surface Mount Application in Order to Optimize Board Space - High Temperature Soldering: 260°C/10 Seconds at Terminals - Typical ID:less than 1u A above 10V - Low Profile Package - Repetition Rate( duty cycle): 0.01% - Glass Passivated Junction - Excellent Clamping Capability - Halogen Free Available Upon Request By Adding Suffix "-HF" - Moisture Sensitivity Level 1 - Epoxy Meets UL 94 V-0 Flammability Rating - Lead Free Finish/Ro HS pliant (Note1) ("P" Suffix Designates pliant. See Ordering Information) Mechanical Data - Polarity: Color Band Denotes Positive End( cathode) Except Bi-directional Types - Standard Packaging: 16mm Tape Per ( EIA 481) - Weight: 0.007 ounce, 0.21 gram - Terminals: Solderable Per MIL-STD-750, Method 2026 Maximum Ratings - Operating Junction Temperature Range: -55°C to +175°C - Storage Temperature Range: -55°C to +175°C - Typical Thermal Resistance: 23°C/W Junction to Ambient Peak Pulse Power Surge Current on IPPM 10/1000μs Waveform See the Table Note 2 Peak Pulse Power Dissipation on 10/1000μs Waveform PPPM 5000W(Min) Note 2,3 Power Dissipationon infinite heat sink 6.5W TL = 75°C. Fast response time typically less than 1.0ps from 0 Volts to BV Min Note: 1. High Temperature Solder Exemption Applied, see EU Directive Annex 7a. 2. Non-repetitive current pulse and derated above TA=25 °C 3. Mounted on 8.0mm2 copper pads to each terminal. Pin Configuration: Cathode Uni-directional...