SK66 Datasheet | Micro Commercial Components

Features For Surface Mount Applications Extremely Low Thermal Resistance Easy Pick And Place High Temp Soldering: 250°C for 10 Seconds At Terminals High Current Capability With Low Forward Voltage - - - Maximum Ratings Operating Temperature: -55°C to +125°C Storage Temperature: -55°C to +150 °C Maximum Thermal Resistance; 18°C/W Junction To Lead Maximum Recurrent Peak Reverse Voltage 20V 30V 40V 45V 50V 60V 80V 100V Maximum RMS Voltage 14V 21V 28V 31.5V 35V 42V 56V 70V Maximum DC Blocking Voltage 20V 30V 40V 45V 50V 60V 80V 100V DIM A B C D E F G H J Cathode Band MCC Part Number SK62 SK63 SK64 SK645 SK65 SK66 SK68 SK610 Device Marking SK62 SK63 SK64 SK645 SK65 SK66 SK68 SK610 DIMENSIONS INCHES MIN .200 .177 .002 --.047 .168 .309 .239 .234 MAX .214 .203 .005 .02 .056 .179 .322 .243 .240 MM MIN 5.08 4.70 .05 --1.20 4.27 7.85 6.08 5.95 MAX 5.43 5.30 .13 .51 1.42 4.55 8.18 6.18 6.10 NOTE Electrical Characteristics @ 25° C Unless Otherwise Specified Average Forward IF(AV) 6.0A TL = 95°C Current Peak Forward Surge IFSM 150A 8.3ms, half sine Current Maximum Instantaneous Forward Voltage SK62-645 VF .65V IFM = 6.0A; SK65-610 .85V TJ = 25°C- Maximum DC 1.0m A TJ = 25°C Reverse Current At IR 20m A TJ = 100°C Rated DC Blocking Voltage Typical Junction CJ 200p F Measured at Capacitance 1.0MHz, VR=4.0V - Pulse test: Pulse width 200 µsec, Duty cycle 2% SUGGESTED SOLDER PAD LAYOUT 0.190” 0.200” 0.070” .mccsemi. Revision: 4 2006/02/03 Free Datasheet http://../ SK62 thru SK610 Figure 1 Typical Forward Characteristics 1000 600 400 200 100 60 40 20 Amps 10 6 4 2 25°C 1 .6 .4 .2 .1 .2 .4 .6 .8 Volts Instantaneous Forward Current - Amperes versus Instantaneous Forward Voltage - Volts Figure 3 Junction Capacitance 100 0 600 400 200 p F 100 60 40 20 10 .1 .2 .4 1 Volts 2 4 10 20 40 TJ =25°C 1.0 1.2 1.4 SK62 -SK645 SK65-SK610 1 3 Amps 2 5 6 Micro mercial ponents Figure 2 Forward Derating Curve Single Phase, Half Wave 60Hz Resistive or Inductive...