SMDJ26A
FEATURES
- For surface mounted applications in order to optimize board space
- Low profile package
- Built-in strain relief
- Glass passivated junction
- Low inductance
- Excellent clamping capability
- Repetition rate (duty cycle):0.01%
- Fast response time: typically less than
1.0 ps from 0 volts to BV for unidirectional types
- Typical IR less than 1µA above 10V
- High temperature soldering:
250°C/10 seconds at terminals
- Plastic package has Underwriters Laboratory
Flammability Classification 94 V-O
MECHANICAL DATA
Case: JEDEC DO214AB. Molded plastic over glass passivated junction Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denoted positive end (cathode) except Bidirectional Standard Packaging: 16mm tape (EIA STD RS-481) Weight: 0.007 ounces, 0.21 grams)
Dimensions in inches and (millimeters)
DEVICES FOR BIPOLAR APPLICATIONS
For Bidirectional use C or CA Suffix for types SMDJ5.0 thru types SMDJ170 (e.g. SMDJ5.0C, SMDJ170CA) Electrical characteristics apply in both directions.
MAXIMUM RATINGS AND CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
RATING
SYMBOL
VALUE
Peak Pulse Power Dissipation on 10/1000 µs waveform (NOTE 1, 2, Fig.1)
PPPM
Minimum 3000
Peak Pulse Current of on 10/1000 µs waveform (Note 1,Fig 3) IPPM SEE TABLE 1
Peak Forward Surge Current, 8.3ms Single Half Sine-wave Superimposed on Rated Load, (JEDEC Method)(Note2, 3)
IFSM
Operatings and Storage Temperature Range
NOTES:
TJ, TSTG
-55 +150
1. Non-repetitive current pulse, per Fig.3 and derated above Ta=25 °C per Fig.2.
2. Mounted on 8.0mm x 8.0mm Copper Pads to each terminal.
3. 8.3ms single half sine-wave, or equivalent square wave, Duty cycle=4 pulses per minutes maximum.
UNITS Watts Amps...
