SMLJ90A Overview
MDE Semiconductor, Inc. • For surface mounted applications in order to optimize board space • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Excellent clamping capability • Repetition rate (duty cycle):0.01% • Fast response time: typically less than 1.0 ps from 0 volts to BV for unidirectional types • Typical IR less than 1µA above 10V • High temperature soldering: 250°C/10 seconds at terminals • Plastic package has Underwriters Laboratory Flammability Classification 94 V-O MECHANICAL DATA DO-214AB (SMC J-Bend)
SMLJ90A Key Features
- For surface mounted
