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MXC4003XC - Three-Axis Accelerometer

Download the MXC4003XC datasheet PDF (MXC4000XC included). The manufacturer datasheet provides complete specifications, pinout details, electrical characteristics, and typical applications for three-axis accelerometer.

Description

The MEMSIC Three-Axis Thermal Accelerometer is based on MEMSIC’s Proprietary thermal technology that is built with 0.18µm standard CMOS process and the most advanced Wafer Level Packaging.

Features

  • Ultra Low Cost.
  • Most Advantaged Technology in Industry.
  • Monolithically-Integrated Single Chip MEMS Sensor with On-Chip Signal Processing.
  • MEMSIC Proprietary Technology with No Moving Parts.
  • >200,000g Shock Survival Rating of Sensing Structure.
  • 12-bit Signal Output for X, Y and Z Axes.
  • Full Scale Range ±2g, ±4g and ±8g.
  • 8-bit Temperature Output (-50°C to +100°C).
  • Smallest Wafer Level Package (WLP) Footprint 1.18mm×1.70mm×0.85mm.
  • 6-Position Orient.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MXC4000XC-MEMSIC.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number MXC4003XC
Manufacturer MEMSIC
File Size 959.14 KB
Description Three-Axis Accelerometer
Datasheet download datasheet MXC4003XC Datasheet

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Full PDF Text Transcription

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Monolithic and Wafer Level Packaged Three-Axis Accelerometer MXC400xXC FEATURES  Ultra Low Cost  Most Advantaged Technology in Industry  Monolithically-Integrated Single Chip MEMS Sensor with On-Chip Signal Processing  MEMSIC Proprietary Technology with No Moving Parts  >200,000g Shock Survival Rating of Sensing Structure  12-bit Signal Output for X, Y and Z Axes  Full Scale Range ±2g, ±4g and ±8g  8-bit Temperature Output (-50°C to +100°C)  Smallest Wafer Level Package (WLP) Footprint 1.18mm×1.70mm×0.85mm  6-Position Orientation Detection  Shake Detection with Interrupt  Programmable Shake Detection Threshold  I2C Slave, FAST (≤400 KHz) Mode Interface  1.8~3.6V Single Supply Continuous Operation  1.
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