MXC4003XC Description
The MEMSIC Three-Axis Thermal Accelerometer is based on MEMSIC’s Proprietary thermal technology that is built with 0.18µm standard CMOS process and the most advanced Wafer Level Packaging. This device contains no moving sensor parts and thus eliminates field reliability and repeatability issues associated with petitive products. For example, Information furnished by MEMSIC is believed to be accurate and reliable.
MXC4003XC Key Features
- Ultra Low Cost
- Most Advantaged Technology in Industry
- Monolithically-Integrated Single Chip MEMS
- MEMSIC Proprietary Technology with No
- >200,000g Shock Survival Rating of Sensing
- 12-bit Signal Output for X, Y and Z Axes
- Full Scale Range ±2g, ±4g and ±8g
- 8-bit Temperature Output (-50°C to +100°C)
- Smallest Wafer Level Package (WLP) Footprint
- 6-Position Orientation Detection