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MXC62323F - Dual Axis Accelerometer

Download the MXC62323F datasheet PDF. This datasheet also covers the MXC62320EP variant, as both devices belong to the same dual axis accelerometer family and are provided as variant models within a single manufacturer datasheet.

Description

The MXC6232xE/F is low cost, dual axis accelerometers fabricated on a standard, submicron CMOS process.

Features

  • RoHS compliant I2C Slave, FAST (≤400 KHz. ) mode interface 1.8V compatible I/O Embedded Power up/down and self-test function On-chip temperature sensor Eight, customer defined 7-bit addresses 2.7 V to 3.6 V single supply continuous operation Monolithic CMOS IC Low power consumption: typically 50,000 g shock survival rating Low profile LCC package: 5mm X 5mm X 1.55mm.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MXC62320EP-MEMSIC.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number MXC62323F
Manufacturer MEMSIC
File Size 147.17 KB
Description Dual Axis Accelerometer
Datasheet download datasheet MXC62323F Datasheet

📁 Similar Datasheet

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MXC6202N Dual Axis Accelerometer ETC
MXC6255XC Chip Scale Packaged Digital Thermal Orientation Sensing Accelerometer MEMEIS

Other Datasheets by MEMSIC

Part Number Description
MXC62323E Dual Axis Accelerometer
MXC62323MP Dual Axis Accelerometer
MXC62320E Dual Axis Accelerometer
MXC62320F Dual Axis Accelerometer
MXC62320MP Dual Axis Accelerometer

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Low Power, Low Profile ±1.5 g Dual Axis Accelerometer with I2C Interface MXC6232xE/F FEATURES RoHS compliant I2C Slave, FAST (≤400 KHz.) mode interface 1.8V compatible I/O Embedded Power up/down and self-test function On-chip temperature sensor Eight, customer defined 7-bit addresses 2.7 V to 3.6 V single supply continuous operation Monolithic CMOS IC Low power consumption: typically <2 mA @ 3.0 V Resolution better than 1 mg On chip mixed signal processing >50,000 g shock survival rating Low profile LCC package: 5mm X 5mm X 1.
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