S3A
Key Features
- Plastic package has underwrites laboratory flammability
- For surface mounted applications
- Low profile package
- Built-in strain relief, ideal for automated placement
- Glass Passivated chip junction
- High temperature soldering
- Case: JEDED DO-214AA molded plastic over glass passivated chip
- Terminals: Solder plated, Solderable per MIL-STD-750, method 2026
- Polarity: Color band denotes cathode end
- Weight: 0.007ounce, 0.25 gram
