SMA51 Datasheet | MIC

FEATURES - For surface mounted applications in order to optimize board space - Low profile package - Built-in strain relief - Glass passivated junction - Low inductance - Excellent clamping capability - Repetition Rate (duty cycle): 0.01% - Fast response time: typical less than 1.0ps from 0 volts to BV for unidirectional types - Typical ID less than 1μA above 10V - High temperature soldering: 250℃/W seconds at terminals - Plastic package has Underwriters Laboratory Flammability Classification 94V-O DO-214AC(SMA) Dimensions in inches and (millimeters) MECHANICAL DATA - Cass: JEDEC DO-214 AC, low profile molded plastic - Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 - Polarity: Indicated by cathode band except bi-directional types - Weight: 0.002 ounces, 0.064 gram - Standard Packaging: 12mm tape per (EIA-481) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS - Ratings at 25℃ ambient temperature unless otherwise specified Peak Pulse Power Dissipation at TA=25℃(NOTE1,2,5)Fig.1 Peak Forward Surge Current per Figure 5 (NOTE 3) Peak Pulse Current on 10/10000μs wave from (NOTE1,FIG.2) Steady Stage Power Dissipation (Note 4) Operating Junction and Storage Temperature Range Symbols PPPM IFSM IPPM PM(AV) TJ, TSTG Value Minimum 400 40.0 See Table 1 1.0 50 to + 150 Notes: 1. Non-repetitive current pulse, per Fog.3 and derated above TA=25℃ per Fig.2 2. mounted on 5.0mm2 copper pads to each terminal. 3. 8.3ms single half sine-wave duty cycle = 4 pulses per minutes maximum. 4. Lead temperature at 75℃ = TL. 5. Peak pulse power waveform is 10/1000μS. Unit Watts Amps Amps Watts ℃ Web Site: .hkmic. SURFACE MOUNT TRANSIENT VOLTAGE...