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MSM8521C-020 - 512K x 8 Static RAM

Description

The MSM8512C is a 512K x 8 SRAM monolithic device available in Chip Size BGA (Ball Grid Array) package, with access times of 20ns.

The device is available to commercial and industrial temperature www.DataSheet4U.com grades.

The Chip Size BGA provides an ultra high density memory packaging solution.

Features

  • Access times of 20 ns.
  • 5V + 10%, (3.3V Under Development).
  • Commercial & Industrial temperature grades.
  • Chip Size BGA.
  • 48 pad, 1mm pad pitch, package.
  • Eutectic 63/67 solder ball attach.
  • Low Power Dissipation. Operating 1 W (max) Standby (CMOS) 66mW (max).
  • Completely Static Operation.
  • 4 layer BT substrate with power and ground planes.
  • Pinout and footprint will remain the same in the event of a die shri.

📥 Download Datasheet

Datasheet Details

Part number MSM8521C-020
Manufacturer MOSAIC
File Size 188.66 KB
Description 512K x 8 Static RAM
Datasheet download datasheet MSM8521C-020 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
512K x 8 Static RAM MSM8512C - 020 Issue 5.2 April 2001 Description The MSM8512C is a 512K x 8 SRAM monolithic device available in Chip Size BGA (Ball Grid Array) package, with access times of 20ns. The device is available to commercial and industrial temperature www.DataSheet4U.com grades. The Chip Size BGA provides an ultra high density memory packaging solution. The Chip Size BGA occupies less than 50% of the board area of conventional SOP, SOJ and TSOP II packages. Block Diagram /CS /OE /WE A0 A1 A2 A3 A4 A5 A6 A7 A8 512K x 8 SRAM D0 D1 D2 D3 D4 D5 D6 D7 Features • Access times of 20 ns. • 5V + 10%, (3.3V Under Development) • Commercial & Industrial temperature grades • Chip Size BGA. • 48 pad, 1mm pad pitch, package. • Eutectic 63/67 solder ball attach. • Low Power Dissipation.
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