KBP04 Datasheet | Mospec Semiconductor

FEATURES Low cost High forward surge current capability Ideal for printed circuit board High temperature soldering guaranteed: 260oc/10 second at 5 lbs. (2.3kg) tension MECHANICAL DATA Case: Transfer molded plastic Epoxy: UL94V-O rate flame retardant Terminals Lead Solderable Per MIL-STD-202E method 208C Polarity As Marking on Body Mounting Position: Any Weight 0.069 ounce, 1.95 gram MAXIMUM RATINGS AND ELECTRICAL CHARATERISTICS - Rating at 25 ambient temperature unless otherwise specified - Single phase,half wave. 60Hz, resistive or inductive load. - For capacitive load derate current by 20 % Characteristic Symbol KBP005 KBP01 KBP02 KBP04 KBP06 KBP08 KBP10 RS201 RS202 RS203 RS204 RS205 RS206 RS207 Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM 50 100 200 400 600 800 1000 Unit V RMS Reverse Voltage VR(RMS) Average Rectifier Forward Current (Note 1) @ TA=50 Non-Repetitive Peak Surge Current 8.3 ms Single half sine-wave superimposed on rated load ( JEDEC Method) Forward Voltage (per element) ( IF =2.0 Amp) Peak Reverse Current ( Rated DC Voltage, TC = 25 ) ( Rated DC Voltage, TC = 100 ) Rating for Fusing( t<8.3 ms) Typical Junction Capacitance per element (Note2) IO(AV) IFSM VFM IR I2t CJ Typical Thermal Resistance (note 3) Operating and Storage Temperature Range Rθ j A TJ , Tstg 70 140 280 420 560 700 2.0 50 1.0 10 0.5 10 20 -65 to +150 u A m A A2s p F k/W Note: 1 Lead maintained at ambient temperature at a distance of 9.5 mm from the case. 2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C. 3. Thermal resistance junction to ambient, mounted on PC board with 12 mm2 copper...