MSI EMSBC
The EMSBC series back contact chip resistor offers a space-saving design in a 0.020" x 0.020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment to the substrate.| Part No. | EMSBC |
|---|---|
| Datasheet | EMSBC Download |
| Manufacturer |  MSI |
| Description | THIN FILM EMSBC SERIES |
| Buy | Stock & Price |
THIN FILM EMSBC SERIES EMSBC SERIES Wire bonding is made to the notched pad on top of the chip. EMSBC's offer the high stability , low noise, and low T .C.R. of thin film while providing greater flexibility in hybrid stability, T.C.R. designs. Excellent for use in Vision Recognition Systems. CHIP RESISTORS MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE 0.020" x 0.020" x 0.010" (±0.003") SILICON TANT ALUM NITRIDE ANTALUM 15,000 Å ALUMINUM TYPICAL (GOLD BOND P ADS OPTIONAL) PADS GOLD; Suitable for eutectic or conductive epoxy bonding ELECTRICAL DA TA DAT RESIST ANCE RANGE RESISTANCE TOLERANCES T.C.R. Layout varies with value. 5 Ω TO 1.2M Ω 0.05%, 0.1%, 0.25%, 0.5% 1%, 2%, 5%, 10% (RESISTOR VALUE DEPENDENT) ±250ppm ST ANDARD; ±100ppm A vailable ≥ 500Ω, ≤ 250KΩ STANDARD; Available SERIES DA TA DAT CURRENT NOISE DIELECTRIC BREAKDOWN INSULA TION RESIST ANCE INSULATION RESISTANCE OPERA TING VOL OPERATING VOLT TAGE POWER RA TING RATING SHORT TERM OVERLOAD HI...