MSV MBD6100L
Monolithic Dual Switching Diode
APPLICATIONS
Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable.MAXIMUM RATINGS
(EACH DIODE) Rating Reverse Voltage Forward Current Peak Forward Surge Current Symbol VR IF I FM(surge) Value 70 200 500 Unit Vdc mAdc mAdc THERMAL CHARACTERISTICS Characteristic Total Device Dissipation FR– 5 Board (1) T A = 25°C Derate above 25°C Thermal Resistance, Junction to Ambient Total Device Dissipation Alumina Substrate, (2) T A = 25°C Derate above 25°C Thermal Resistance, Junction to Ambient Junction and Storage Temperature Symbol PD R θ JA PD R θ JA T J , T stg Max 225 1.8 556 300 2.4 417 –55 to +150 Unit mW mW/°C °C/W mW mW/°C °C/W °C 3 1 2 SOT– 23 3 CATHODE ANODE 1 2 ANODEELECTRICAL CHARACTERISTICS
(T A = 25°C unless otherwise noted)(EACH DIODE) Characteristic Symbol Min OFF CHARACTERISTICS Reverse Breakdown Voltage (I (BR) = 100 µAdc) V (BR) 70 Reverse Voltage Leakage Current (V R = 50 Vdc) Forward Voltage (I F = 1.0 mAdc) (I F = 100 mAdc) Reverse Recovery Time (I F = I R = 10 mAdc,IR(REC)=1.0mAdc) (Figure 1) Capacitance(VR=0V) 1.