MSO9180D1R
MSO9180D1R is Layout guide line manufactured by MStar.
Layout guide line
MSO9180D1RLGL V0.1
© 2013 MStar Semiconductor, Inc. All rights reserved.
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F-3697
REVISION HISTORY
Revision No. Description 0.1
- Initial release
- -
- -
- -
{MSD6A918} { Application Note} {MSD6A918 APN 0.1}
Date 12/03/2013
Security Level: Confidential B
-i Copyright © 2013 MStar Semiconductor, Inc. All rights reserved.
12/20/2013
1. PCB LAYOUT GUIDE
1.1. Power and GND
2.1.1. 4 层板 PCB 板材
2.1.2. 走线宽度
按照常用 1 盎司铜厚，对于承受电流至少需要满足：每 1A 电流对应 40mil 线宽。 电源走线如有换层，在连接处至少放置两个过孔，保证连接性。 需要特别注意: 1）3.3VSTB 到 LDO 输出线宽>=40mil 2）3.3Vnorma 到 LDO 输出线宽>=40mil 3）2.5Vnormal 到 LDO 输出线宽>=40mil 4）1.5Vnormal 到 DCDC 输出线宽>=40mil 5）1.8Vnormal 到 LDO 输出线宽>=40mil 6）core Power 到 DC/DC 输出线宽>=120mil
Security Level: Confidential B
-1Copyright © 2013 MStar Semiconductor, Inc. All rights reserved.
12/20/2013
2.1.3. 元件摆放 1）DC/DC 输入端:储能电容>=20u F,滤波电容 0.1u 靠近放置。 2）肖特基二极管，输出电感，输出储能电容>=22u F,滤波电容 0.1u 靠近 DC/DC 放 置，尽可能输出的环路。 3)E-PAD 上 Via 至少要加 9 个。
3）LDO 输入，输出的网络在附近放置有 2.2u F 以上的退耦电容。多个靠近放置的 LDO 供电输入是相同，且网络上同时有多个电解电容的可以考虑共用。
2.1.4. 散热 1）LDO 插入功耗（△ V×I)>0.3W，需要加背面散热铜皮，插入功耗（△ V×I)>1W， 如果压差>2V,可以加插件功率电阻分摊功率；如果压差<2V 的情况，考虑更换散
Security Level: Confidential B
-2Copyright © 2013 MStar Semiconductor, Inc. All rights...
