MX23L12824 Overview
2.7 ~ 3.6V Package - 64 ball mini BGA (10.0mm X 13.0mm, ball pitch 1.0mm) Temperature . For single-chip applications, CE2#, CE1# can be strapped to GND. 12, 2004 1 DataSheet 4 U.
MX23L12824 Key Features
- Bit organization Symbol
- 16Mb x 8 (byte mode) A0~A23
- 8Mb x 16 (word mode)
- Fast access time D0~D15
- Random access:120/25ns(max.) in 3.0~3.6V 120/30ns(max.) in 2.7~3.6V CE0#,CE1#,CE2#
- Page size OE#
- 8 words per page BYTE#
- Current VCC
- Operating:50mA VCCQ
- Standby:15uA(max.)