CR10A Datasheet PDF

FEATURES

Solid State Ceramic Chip Surface Mounting Device High Power Thermal Absorbtion Superior Light Uniformity Over 180° End to End Side to Side Stackable Down to a Pitch of 1,33mm Solder Pads Conform to Mil−Std 883B Amber Clear Lens

APPLICATIONS

Ideal For Back Light

APPLICATIONS

Custom Configurations

APPLICATIONS

for Night Light Conditions

MAXIMUM RATINGS

(Ta=25 C) Characteristic Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Soldering Temperature Soldering Time Symbol IF VR PD Topr Tstg Tsol − Max. 75 100 130.00 Unit mA V mW o o o −25 ~ +80 −25 ~ +120 250 for 10 sec. max Opto−

ELECTRICAL CHARACTERISTICS

(Ta=25 C) Characteristic Forward Voltage Reverse Current Luminous Intensity Viewing Angle Peak Wavelength Dominant Wavelength w w w VF IR IV λp λd ∆λ Symbol t a .D C C o S a − e h Min − − U 4 t e .c m o C − o Test Condition IF=20mA VR=5V IF=20mA Typ 2.20 − 5.30 180 o Max 2.40 100 − − − − − Unit V µA mcd deg. nm nm nm 1.80 − − − − 2θ1/2 IF...