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AN611 - TD-SCDMA Radio Chipset Block Diagram for Handset Application

Key Features

  • q q q q Output power of +8dBm with excellent ACPR A 100dB power-control range Dual integer-N synthesizers for IF and RF An image-reject upconverting mixer, which saves one SAW filter q q q Power-supply current dropping as the RF output power is reduced Low-noise power during the power-down mode Availability in a 48-pin QFN package (7mm x 7mm) Power Amplifier The MAX229X is a linear amplifier optimized for TD-SCDMA.

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Full PDF Text Transcription (Reference)

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WIRELESS, RF, AND CABLE Jun 01, 2001 TD-SCDMA Radio Chipset Block Diagram for Handset Application China option for 3G cellular phone is the TD-SCDMA system. A detailed handset transceiver diagram is presented showing MAX2361 as the transmit IC, the MAX2291 as the power amplifier (PA), and the MAX2388 and MAX2309 form the receiver. A VCO buffer amplifier is used to provide isolation and maintains a clean LO signal. Overview TD-SCDMA is the third-generation (3G) cellular phone standard currently under development in China. In November 1999, the TD-SCDMA standard was adopted by the ITU as one of the options in the 3GPP mobile communication standard.