DS9503 Datasheet | Maxim Integrated

FEATURES - Zener characteristic with voltage snap- back to protect against ESD hits - High avalanche voltage, low leakage and low capacitance avoid signal attenuation - patible to all 5V logic families - Space saving, low inductance TSOC surface mount package - On- chip 5resistors for isolation at both anode and cathode terminals - Industrial temperature range SYMBOL AND CONVENTIONS C IC PACKAGE OUTLINE TSOC SURFACE MOUNT PACKAGE 16 25 34 TOP VIEW SIDE VIEW ORDERING INFORMATION DS9503P+ 6-lead TSOC package DS9503P+T&R 6-lead TSOC package +Denotes a lead(Pb)-free/Ro HS-pliant package. T&R = Tape and reel. DESCRIPTION This DS9503 is designed as an ESD protection device for 1- Wire Micro LAN interfaces. In contrast to the DS9502, the DS9503 includes two 5isolation resistors on chip. Although 5are negligible during munication, they represent a high...